Casa> Blog> Structural design of semiconductor heat sink corrugated cardboard packaging

Structural design of semiconductor heat sink corrugated cardboard packaging

July 31, 2022


(Text / Xiao Ying Wu Ruomei Huang Yanan Zhuzhou Institute of Technology)

<Packaging Project>
Contattaci

Author:

Ms. Christina

Phone/WhatsApp:

+8613763260555

Prodotti popolari
You may also like
Related Categories

Mail a questo fornitore

Oggetto:
Mobile:
E-mail:
messaggio:

Your message must be betwwen 20-8000 characters

Comunicare con Fornitore?Fornitore
Christina Ms. Christina
Cosa posso fare per te?
Chatta adesso Contattare il Fornitore